4_2019_sen_6

Title of the article

STRUCTURAL DESIGN AND TAILORING OF COMPOSITES TO OBTAIN NEAR ZERO COEFFICIENT OF LINEAR THERMAL EXPANSION
Authors

SHIL’KO Sergey V., Ph. D. in Eng., Assoc. Prof., Head of the Laboratory, V.A. Belyi Metal-Polymer Research Institute of the NAS of Belarus, Gomel, Republic of Belarus, This email address is being protected from spambots. You need JavaScript enabled to view it.">This email address is being protected from spambots. You need JavaScript enabled to view it.

PETROKOVETS Ekaterina M., Researcher, V.A. Belyi Metal-Polymer Research Institute of the NAS of Belarus, Gomel, Republic of Belarus, This email address is being protected from spambots. You need JavaScript enabled to view it.">This email address is being protected from spambots. You need JavaScript enabled to view it.

ZHANG Qiang, D. Sc. in Eng., Prof., Professor, Harbin Institute of Technology, Harbin, People’s Republic of China, This email address is being protected from spambots. You need JavaScript enabled to view it.">This email address is being protected from spambots. You need JavaScript enabled to view it.
In the section TECHNOLOGICAL MECHANICS
Year 2019 Issue 4 Pages 55–60
Type of article RAR Index UDK 536.413:539.3:678.01 Index BBK  
Abstract The paper discusses the realization of high dimensional stability of products, including minimization of thermal strains by the use of additives having negative coefficient of linear thermal expansion, as well as auxetics having negative Poisson’s ratio. Mechanisms of change of thermal stress state of the porous, dispersion-reinforced and layered materials are established during heating and cooling, depending on elasticity moduli, the size of inclusions, a parity of rigidity of the matrix and the filler as well as boundary conditions. The results of structural design make it possible to improve dimensional stability and reduce residual stresses of microelectronics elements, precise equipment for aerospace engineering and measuring instruments.
Keywords

measuring instrument, microelectronics elements, functional materials, aluminum alloys, auxetics, zirconium tungstate, thermal expansion, residual stresses, finite element analysis
   
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